HSP-2参数：THERMAL PAD SNGL PHASE WADHESVE
类别：风扇，热管理-热 - 垫，片其它有关文件： DeclarationofConformity标准包装：24系列：HSP应用：单相SSR，M50电源模块形状：矩形外形：57.15mmx44.45mm厚度：0.005"（0.127mm）材料：-粘合剂：粘合剂-一侧底布，载体：-颜色：黑热阻率：-导热率：2.0W/m-K配用：H16WD6025G-10-ND-RELAYSSR25A660VACRANDDCINH16WD6090G-10-ND-RELAYSSR90A660VACRANDDCINH16WD6090G-ND-RELAYSSR90A660VACZERODCINH16WD6075G-10-ND-RELAYSSR75A660VACRANDDCINH16WD6075G-ND-RELAYSSR75A660VACZERODCINH16WD6050G-10-ND-RELAYSSR50A660VACRANDDCINH16WD6050G-ND-RELAYSSR50A660VACZERODCINH16WD6025G-ND-RELAYSSR25A660VACZERODCINCC1881-ND-RELAYSSR90A660VACRANDDCINCC1880-ND-RELAYSSR90A660VACZERODCIN更多...
